欢迎光临!1kic网专注于为电子元器件行业提供免费及更实惠的芯片ic交易网站。
热门关键词: LM358 TL431 ULN2003 OP07 STM32F103C8T6
MXIC旺宏微代理商
发表于:2013-12-27 类别: [热卖]

MXIC Serial/Parallel Flash   系列产品特点:

•体积小— 由于串行flash采用比并行flash更少的连线在一个系统中传送数据,所以缩小的系统板的空间,能常采用SOIC8、DFN、BGA等封装;
•低功耗 — 串行SPI FLASH器件采用串行接口进行连续数据存取,所以可以达到工作电流:7mA  待机电流:8uA;
•工作温度范围宽 - 最新的Q版本工作温度在-40 to +105;
•快速擦除烧录程式 —通过4KByte统一Sector-Erase,32Kbyte或者64Kbyte Block-Erase或者Chip- Erase能力,目前已达到数据擦除:18mS; 
•成本低,用途广 - 由于是台湾生产与加工,无形中降低了很多成本。广泛应用于数码类以及消费类电子产品中; 
•产品线长 - 串行SPI FLASH产品提供512Kb - 128Mb的密度、I2C、Microwire 和 SPI 兼容协议。

 

 MXIC Serial Flash系列规格参数
Part No.DensityVoltageTemp RangeMax Freq(MHz)Package(s)
MX25L5121E512Kb3V-40°C to +85°C 45SOIC8(150mil) TSSOP8(173mil) USON8(2*3mm)
MX25V512512Kb2.5V-40°C to +85°C 50USON8(2*3mm)
MX25V512C512Kb2.5V-40°C to +85°C 50TSSOP8(173mil) USON8(2*3mm)
MX25V512E512Kb2.5V-40°C to +85°C 75(x1) 70(x2)TSSOP8(173mil) USON8(2*3mm)
MX25L1006E1Mb3V-40°C to +85°C 104(x1) 80(x2)SOIC8(150mil) USON8(2*3mm)
MX25L1021E1Mb3V-40°C to +85°C 45SOIC8(150mil) 
MX25L1025C1Mb3V-40°C to +85°C 85SOIC8(150mil) 
MX25L1026E1Mb3V-40°C to +85°C 104(x1) 80(x2)SOIC8(150mil) 
MX25V1006E1Mb2.5V-40°C to +85°C 75(x1) 70(x2)TSSOP8(173mil) USON8(2*3mm)
MX25L20052Mb3V-40°C to +85°C 85SOIC8(150mil) WSON8(6*5mm) 
MX25L2006E2Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) WSON8(6*5mm) USON8(2*3mm)
MX25L2026C2Mb3V-40°C to +85°C 85SOIC8(150mil) 
MX25L2026E2Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) 
MX25U2033E2Mb1.8V-40°C to +85°C 80(x1, x2)     70(x4)SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm)
MX25V2006E2Mb2.5V-40°C to +85°C 75(x1) 70(x2)SOIC8(150mil) WSON8(6*5mm)
MX25L4006E4Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) PDIP8(300mil) 
MX25L4026E4Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil)
MX25U4033E4Mb1.8V-40°C to +85°C 80(x1, x2) 70(x4)SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm)
MX25U40354Mb1.8V-40°C to +85°C 40(x1, x2) 33(x4)SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm)
MX25V4006E4Mb2.5V-40°C to +85°C 75(x1) 70(x2)SOIC8(150mil) WSON8(6*5mm) 
MX25V40354Mb2.5V-40°C to +85°C 66(x1) 50(x2, x4)SOIC8(150mil) WSON8(6*5mm) 
MX25L8006E8Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) PDIP8(300mil) 
MX25L8035E8Mb3V-40°C to +85°C 108(x1, x4) 80(x2)SOIC8(200mil)
MX25L8036E8Mb3V-40°C to +85°C 133(x1, x2, x4)SOIC8(200mil)
MX25U8033E8Mb1.8V-40°C to +85°C 80(x1, x2) 70(x4)SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm)  
MX25U80358Mb1.8V-40°C to +85°C 40(x1, x2) 33(x4)SOIC8(150mil) WSON8(6*5mm) USON8(2*3mm)  
MX25U8035E8Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm)  
MX25V8006E8Mb2.5V-40°C to +85°C 75(x1) 70(x2)SOIC8(150mil) WSON8(6*5mm)
MX25V80358Mb2.5V-40°C to +85°C 66(x1) 50(x2, x4)SOIC8(150mil) WSON8(6*5mm)
MX25L1606E16Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) SOIC8(200mil) SOIC8(300mil) PDIP8(300mil) USON8(2*3mm) WSON8(6*5mm) TFBGA24(6*8mm)   
MX25L1633E16Mb3V-40°C to +85°C 104(x1) 85(x2, x4)SOIC8(200mil) WSON8(6*5mm)
MX25L1635E16Mb3V-40°C to +85°C 108(x1, x4) 80(x2)SOIC8(200mil) 
MX25L1636D16Mb3V-40°C to +85°C 86(x1) 75(x2, x4)SOIC8(200mil) SOIC16(300mil) 
MX25L1636E16Mb3V-40°C to +85°C 133(x1, x2, x4)SOIC8(200mil) 
MX25U1635E16Mb1.8V-40°C to +85°C 104(x1,x4) 84(x2)SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm)  
MX25L3206E32Mb3V-40°C to +85°C 86(x1) 80(x2)SOIC8(150mil) SOIC8(200mil) SOIC8(300mil) PDIP8(300mil) USON8(2*3mm) WSON8(6*5mm) TFBGA24(6*8mm)   
MX25L3225D32Mb3V-40°C to +85°C 104(x1) 75(x2, x4)SOIC8(200mil)
MX25L3235D32Mb3V-40°C to +85°C 104(x1) 75(x2, x4)SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) WSON8(6*5mm)  
MX25L3235E32Mb3V-40°C to +85°C 104(x1, x4) 86(x2)SOIC8(200mil) SOIC16(300mil) WSON8(6*5mm)
MX25L3236D32Mb3V-40°C to +85°C 86(x1) 75(x2, x4)SOIC8(200mil)
MX25L3237D32Mb3V-40°C to +85°C 86(x1) 75(x2, x4)SOIC16(300mil) WSON8(6*5mm)
MX25U3235E32Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)SOIC8(200mil) WSON8(6*5mm)
MX25U3235F32Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)SOIC8(200mil) WSON8(6*5mm)
MX25L6406E64Mb3V-40°C to +85°C 86(x1) 80(x2) SOIC8(200mil) SOIC16(300mil)  WSON8(8*6mm) TFBGA24(6*8mm)   
MX25L6435E64Mb3V-40°C to +85°C 104(x1, x4) 86(x2) SOIC8(200mil) SOIC16(300mil)  WSON8(8*6mm)
MX25L6436E64Mb3V-40°C to +85°C 104(x1) 70(x2, x4) SOIC8(200mil) SOIC16(300mil)  WSON8(8*6mm)
MX25L6445E64Mb3V-40°C to +85°C 104(x1) 70(x2, x4) SOIC8(200mil) SOIC16(300mil)  WSON8(8*6mm)
MX25L6465E64Mb3V-40°C to +85°C 104(x1) 70(x2, x4) SOIC8(200mil) SOIC16(300mil)  WSON8(8*6mm)
MX25U6435E64Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)WSON8(6*5mm)
MX25U6435F64Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)SOIC8(200mil) WSON8(6*5mm)
MX25L12835E128Mb3V-40°C to +85°C 104(x1) 70(x2, x4)SOIC16(300mil) WSON8(8*6mm)
MX25L12836E128Mb3V-40°C to +85°C 104(x1) 70(x2, x4)SOIC16(300mil) WSON8(8*6mm)
MX25L12845E128Mb3V-40°C to +85°C 104(x1) 70(x2, x4)SOIC16(300mil)  WSON8(8*6mm)
MX25L12865E128Mb3V-40°C to +85°C 104(x1) 70(x2, x4)SOIC16(300mil)  WSON8(8*6mm)
MX25U12835F128Mb1.8V-40°C to +85°C 104(x1, x4) 84(x2)SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm)
MX25L25635E256Mb3V-40°C to +85°C 80(x1) 70(x2, x4)SOIC16(300mil) WSON8(8*6mm)
MX25L25635F256Mb3V-40°C to +85°C 133(x1, x2, x4)SOIC16(300mil) WSON8(8*6mm)
MX25L25735E256Mb3V-40°C to +85°C 80(x1) 70(x2, x4)SOIC16(300mil) WSON8(8*6mm)
MX25L25835E256Mb3V-40°C to +85°C 104(x1) 70(x2, x4)SOIC16(300mil)
MXIC Parallel Flash系列规格参数
Part No.DensityVoltageTemp RangeSpeed(ns)Package(s)
MX29F200C T/B2Mb5V-40°C to +85°C 70TSOP-48
MX29F040C4Mb5V-40°C to +85°C 70TSOP-32 PLCC-32
MX29F400C T/B4Mb5V-40°C to +85°C 70SOP-44 TSOP-48
MX29LV004C T/B4Mb3V-40°C to +85°C 70PLCC-32
MX29LV040C4Mb3V-40°C to +85°C 70TSOP-32 PLCC-32
MX29LV400C T/B4Mb3V-40°C to +85°C 70SOP-44 LFBGA-48 TFBGA-48
TSOP-48 WFBGA-48 XFLGA-48
MX29SL402C T/B4Mb1.8V-40°C to +85°C 90TSOP-48 TFBGA-48 LFBGA-48
WFBGA-48 XFLGA-48
MX29F800C T/B8Mb5V-40°C to +85°C 70SOP-44 TSOP-48 FBGA-48
MX29LV800C T/B8Mb3V-40°C to +85°C 70SOP-44 TSOP-48 TFBGA-48
LFBGA-48 WFBGA-48 XFLGA-48
MX29LV160D T/B16Mb3V-40°C to +85°C 70TSOP-48 TFBGA-48 WFBGA-48
XFLGA-48 LFBGA-48
MX29LV161D T/B16Mb3V, (VI/O)-40°C to +85°C 90TSOP-48 TFBGA-48 WFBGA-48
XFLGA-48 LFBGA-48
MX29GL320E H/L32Mb3V-40°C to +85°C 70TSOP-56 LFBGA-64
MX29GL320E T/B32Mb3V-40°C to +85°C 70TSOP-48 FBGA-48
MX29LV320E T/B32Mb3V-40°C to +85°C 70SOP-44 TSOP-48
LFBGA-48 TFBGA-48
MX29LV321D T/B32Mb3V-40°C to +85°C 90TSOP-48 TFBGA-48
MX29GL640E H/L64Mb3V-40°C to +85°C 70TSOP-56
LFBGA-64
MX29GL640E T/B64Mb3V-40°C to +85°C 70TSOP-48 LFBGA-48
MX29LV640E T/B64Mb3V-40°C to +85°C 70TSOP-48 TFBGA-48
MX29GL128E128Mb3V (VI/O)-40°C to +85°C 90TSOP-56 FBGA-64
LFBGA-64 SSOP-70
MX29GL128F H/L128Mb3V (VI/O)-40°C to +85°C 70FBGA-56 TSOP-56
LFBGA-64
MX29GL128F H/L 128Mb3V-40°C to +85°C 90SSOP-70
MX29GL256E256Mb3V (VI/O)-40°C to +85°C 90TSOP-56 FBGA-64
LFBGA-64 SSOP-70
MX29GL256F H/L256Mb3V (VI/O)-40°C to +85°C 90FBGA-56 TSOP-56 LFBGA-64
MX29GL256F H/L 256Mb3V-40°C to +85°C 90SSOP-70
MX29GL512E H/L512Mb3V-40°C to +85°C 100TSOP-56 LFBGA-64 SSOP-70
MX29GL512F H/L512Mb3V-40°C to +85°C 100TSOP-56 LFBGA-64
MX29GL512F H/L 512Mb3V-40°C to +85°C 100SSOP-70
MX68GL1G0F H/L1Gb3V-40°C to +85°C 110TSOP-56 LFBGA-64
MX68GL1G0F H/L 1Gb3V-40°C to +85°C 110SSOP-70
分享到:
深圳市升邦科技有限公司

联系人:吕小姐

手机:13824321132

座机:
86-0755-33119939
Q Q:
QQ:2355540881
地址:
宝安福永
最新免费信息

1kic网-首个免费IC网-电子元器件ic交易网-芯片集成电路代理商供应商查询