TI公司的MSP430FR2355是超低功耗MSP430FRx系列基于FRAM的微控制器(MCU),提供扩展的数据记录和安全功能,在FRAM微控制器系列产品中采用小型LQFP封装(7mm × 7 mm),集成了各种外设和超低功耗. FRAM(铁电存储器)是一种尖端的存储技术,在非易失存储器中集合了闪存和RAM的最好特性. MSP430FR2355工作电压1.8V-3.6V,具有16位RISC架构,高达24MHz系统时钟和8MHz FRAM接入,32KB可编FRAM,512B信息FRAM和4KB RAM,12路12位ADC,两个增强的比较器和集成的6位DAC作为基准电压,四个智能模拟组合体(SAC-L3),三个16位计时器有三个捕获/比较寄存器(Timer_B3),一个16位计时器有七个捕获/比较寄存器(Timer_B7),32位硬件乘法器(MPY).器件的工作温度–40° 到105°C,主要用在烟雾和热检测器,传感器发送器,电路中断器,传感器信号调理,有线工业通信,光模块以及其电池组管理和收费标签.本文介绍了MSP430FR2355主要特性,功能框图以及开发板MSP‑EXP430FR2355 LaunchPad™主要特性,框图,电路图,材料清单和PCB设计图.

MSP430FR215x and MSP430FR235x microcontrollers (MCUs) are part of the MSP430™ MCU value line portfolio of ultra-low-power low-cost devices for sensing and measurement applications. MSP430FR235x MCUs integrate four configurable signal-chain modules called smart analog combos, each of which can be used as a 12-bit DAC or a configurable programmable-gain Op-Amp to meet the specific needs of a system while reducing the BOM and PCB size. The device also includes a 12-bit SAR ADC and two comparators. The MSP430FR215x and MSP430FR235x MCUs all support an extended temperature range from –40° up to 105°C, so higher temperature industrial applications can benefit from the devices’FRAM data-logging capabilities. The extended temperature range allows developers to meet requirements of applications such as smoke detectors, sensor transmitters, and circuit breakers.

The MSP430FR215x and MSP430FR235x MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode typically in less than 10 μs.

The MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR215x and MSP430FR235x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-EXP430FR2355 LaunchPad™ development kit and the MSP-TS430PT48 48-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ community forum.

MSP430FR2355主要特性:

• Embedded microcontroller
– 16-bit RISC architecture up to 24 MHz
– Extended temperature: –40°C to 105°C
– Wide supply voltage range from 3.6 V down to 1.8 V (operational voltage is restricted by SVS levels, see VSVSH- and VSVSH+ in PMM, SVS and BOR)
• Optimized low-power modes (at 3 V)
– Active mode: 142 μA/MHz
– Standby:
– LPM3 with 32768-Hz crystal: 1.43 μA (with SVS enabled)
– LPM3.5 with 32768-Hz crystal: 620 nA (with SVS enabled)
– Shutdown (LPM4.5): 42 nA (with SVS disabled)
• Low-power ferroelectric RAM (FRAM)
– Up to 32KB of nonvolatile memory
– Built-in error correction code (ECC)
– Configurable write protection
– Unified memory of program, constants, and storage
– 1015 write cycle endurance
– Radiation resistant and nonmagnetic
• Ease of use
– 20KB ROM library includes driver libraries and FFT libraries
• High-performance analog
– One 12-channel 12-bit analog-to-digital converter (ADC)
– Internal shared reference (1.5, 2.0, or 2.5 V)
– Sample-and-hold 200 ksps
– Two enhanced comparators (eCOMP)
– Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
– Programmable hysteresis
– Configurable high-power and low-power modes
– One with fast 100-ns response time
– One with 1-μs response time with 1.5-μA low power
– Four smart analog combo (SAC-L3) (MSP430FR235x devices only)
– Supports General-Purpose Operational Amplifier (OA)
– Rail-to-rail input and output
– Multiple input selections
– Configurable high-power and low-power modes
– Configurable PGA mode supports
– Noninverting mode: ×1, ×2, ×3, ×5, ×9, ×17, ×26, ×33
– Inverting mode: ×1, ×2, ×4, ×8, ×16, ×25, ×32
– Built-in 12-bit reference DAC for offset and bias settings
– 12-bit voltage DAC mode with optional references
• Intelligent digital peripherals
– Three 16-bit timers with three capture/compare registers each (Timer_B3)
– One 16-bit timer with seven capture/compare registers each (Timer_B7)
– One 16-bit counter-only real-time clock counter (RTC)
– 16-bit cyclic redundancy checker (CRC)
– Interrupt compare controller (ICC) enabling nested hardware interrupts
– 32-bit hardware multiplier (MPY32)
– Manchester codec (MFM)
• Enhanced serial communications
– Two enhanced USCI_A (eUSCI_A) modules support UART, IrDA, and SPI
– Two enhanced USCI_B (eUSCI_B) modules support SPI and I2C
• Clock system (CS)
– On-chip 32-kHz RC oscillator (REFO)
– On-chip 24-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
– ±1% accuracy with on-chip reference at room temperature
– On-chip very low-frequency 10-kHz oscillator (VLO)
– On-chip high-frequency modulation oscillator (MODOSC)
– External 32-kHz crystal oscillator (LFXT)
– External high-frequency crystal oscillator up to 24 MHz (HFXT)
– Programmable MCLK prescaler of 1 to 128
– SMCLK derived from MCLK with programmable prescaler of 1, 2, 4, or 8
• General input/output and pin functionality
– 44 I/Os on 48-pin package
– 32 interrupt pins (P1, P2, P3, and P4) can wake MCU from LPMs
• Development tools and software (also see Tools and Software)
– LaunchPad™ development kit (MSP‑EXP430FR2355)
– Target development board (MSP‑TS43048PT)
– Free professional development environments
• Family members (also see Device Comparison)
– MSP430FR2355: 32KB of program FRAM, 512 bytes of data FRAM, 4KB of RAM
– MSP430FR2353: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
– MSP430FR2155: 32KB of program FRAM, 12 bytes of data FRAM, 4KB of RAM
– MSP430FR2153: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
• Package options
– 48-pin: LQFP (PT)
– 40-pin: VQFN (RHA)
– 38-pin: TSSOP (DBT)
– 32-pin: VQFN (RSM)

MSP430FR2355应用:

• Smoke and heat detectors
• Sensor transmitters
• Circuit breakers
• Sensor signal conditioning
• Wired industrial communications
• Optical modules
• Battery pack management
• Toll tags

图1. MSP430FR235x系列功能框图

开发板MSP‑EXP430FR2355 LaunchPad™

MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)

The MSP-EXP430FR2355 LaunchPad™ Development Kit is an easy-to-use Evaluation Module (EVM) for the MSP430FR2355 microcontroller (MCU). The kit contains everything needed to start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming, debugging, and energy measurements. The board also features onboard buttons and LEDs for quick integration of a simple user interface, an onboard Grove connector for external Grove sensors, as well as an ambient light sensor to showcase the integrated analog peripherals.

The 24-MHz MSP430FR2355 device features 32KB of embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. Combined with 4KB of on-chip RAM, users have access to 32KB of memory to split between their program and data as required. For example, a data logging application may require a large data memory with relatively small program memory, so the memory may be allocated as required between program and data memory.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

开发板MSP‑EXP430FR2355 LaunchPad™主要特性:

• MSP ULP FRAM technology based MSP430FR2355 16-bit MCU
• EnergyTrace technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• 2 buttons and 2 LEDs for user interaction
• Ambient light sensor for the Out-of-Box Experience demo
• Grove connector for external Grove sensors
开发板MSP‑EXP430FR2355 LaunchPad™包括:
• 1 MSP-EXP430FR2355 LaunchPad Development Kit
• 1 Micro USB cable
• 1 Quick Start Guide

图2. 开发板MSP‑EXP430FR2355 LaunchPad™外形图

图3. 开发板MSP‑EXP430FR2355 LaunchPad™概述图

 

图4. 开发板MSP‑EXP430FR2355 LaunchPad™框图

图5. 开发板MSP‑EXP430FR2355 LaunchPad™电路图(1)

图6. 开发板MSP‑EXP430FR2355 LaunchPad™电路图(2)

图7. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(1)

图8. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(2)

图9. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(3)

图10. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(4)

图11. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(5)

图12. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(6)

图13. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(7)

图14. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(8)

图15. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(9)

图16. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(10)

开发板材料清单:

Designator	Quantity	Value	Description	PackageReference	PartNumber	Manufacturer	Alternate PartNumber	Alternate Manufacturer
!PCB	1		Printed Circuit Board		MCU036	Any	-	-
C1, C112	2	1000pF	CAP, CERM, 1000 pF, 50 V, +/- 10%, X7R, 0402	0402	GRM155R71H102KA01D	MuRata
C2, C3	2	12pF	CAP, CERM, 12 pF, 25 V, +/- 5%, C0G/NP0, 0402	0402	GRM1555C1E120JA01D	MuRata
C4	1	0.1uF	CAP, CERM, 0.1 µF, 50 V, +/- 20%, X5R, 0402	0402	GRM155R61H104ME14D	MuRata
C5	1	10uF	CAP, CERM, 10 µF, 6.3 V, +/- 20%, X5R, 0603	0603	GRM188R60J106ME84	MuRata
C6	1	1pF	CAP, CERM, 1 pF, 50 V, +/- 10%, C0G/NP0, 0402	0402	GRM1555C1H1R0BA01D	MuRata
C101	1	0.47uF	CAP, CERM, 0.47 µF, 16 V, +/- 10%, X5R, 0402	0402	GRM155R61C474KE01	MuRata
C102, C107	2	0.22uF	CAP, CERM, 0.22 µF, 16 V, +/- 10%, X5R, 0603	0603	GRM188R61C224KA88D	MuRata
C103, C105, C113, C114, C118, C120, C121, C124, C125	9	0.1uF	CAP, CERM, 0.1 µF, 10 V, +/- 10%, X5R, 0402	0402	GRM155R61A104KA01D	MuRata
C104	1	10uF	CAP, TA, 10 µF, 10 V, +/- 20%, 3.4 ohm, SMD	3216-18	293D106X0010A2TE3	Vishay-Sprague
C106, C109	2	4.7uF	CAP, TA, 4.7 µF, 10 V, +/- 10%, 5 ohm, SMD	3216-18	293D475X9010A2TE3	Vishay-Sprague
C108	1	1uF	CAP, CERM, 1 µF, 10 V, +/- 10%, X5R, 0603	0603	GRM185R61A105KE36D	MuRata
C110, C111	2	10pF	CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0, 0402	0402	GRM1555C1H100JA01D	MuRata
C115, C116, C122, C123	4	33pF	CAP, CERM, 33 pF, 50 V, +/- 5%, C0G/NP0, 0402	0402	GRM1555C1H330JA01D	MuRata
C117, C119	2	4.7uF	CAP, CERM, 4.7 µF, 16 V, +/- 10%, X5R, 0603	0603	GRM188R61C475KAAJ	MuRata
C126	1	0.22uF	CAP, CERM, 0.22 µF, 10 V, +/- 10%, X5R, 0402	0402	GRM155R61A224KE19D	MuRata
D1	1	820nm	High Speed PIN Photodiode, SMD	3.2x1.5mm	SFH 2701	OSRAM
D101, D102	2	40V	Diode, Schottky, 40 V, 0.12 A, AEC-Q101, SOT-323	SOT-323	BAS40-05W,115	NXP Semiconductor
H1, H2	2		Spacer Support, Nylon 66	Spacer Nylon Support	MAE-10	Kang Yang
IC101	1		Single Output LDO, 200 mA, Fixed 3.3 V Output, 2 to 5.5 V Input, with Low IQ, 6-pin WSON (DSE), -40 to 125 degC, Green (RoHS & no Sb/Br)	DSE0006A	TLV70033DSET	Texas Instruments	Equivalent	Texas Instruments
IC102	1		ESD-Protection Array for High-Speed Data Interfaces, 4 Channels, -40 to +85 degC, 6-pin SON (DRY), Green (RoHS & no Sb/Br)	DRY0006A	TPD4E004DRYR	Texas Instruments	Equivalent	Texas Instruments
IC103	1		0.75-Ohm DUAL SPST ANALOG SWITCH WITH 1.8-V COMPATIBLE INPUT LOGIC, RSE0008A (UQFN-8)	RSE0008A	TS5A21366RSER	Texas Instruments		Texas Instruments
J1/J3, J2/J4	2		Receptacle, 2.54mm, 10x2, Tin, TH	10x2 Receptacle	SSQ-110-03-T-D	Samtec	CRD-081413-A-G	Major League Electronics
J5, J6	2		Header, 100mil, 3x1, Tin, TH	Header, 3 PIN, 100mil, Tin	PEC03SAAN	Sullins Connector Solutions
J7, J8, J9, J10, J11	5		Header, 100mil, 2x1, Gold, TH	2x1 Header	TSW-102-07-G-S	Samtec
J12	1		Header(shrouded), 2mm, 4x1, Tin, R/A, TH	Header(shrouded), 2mm, 4x1, R/A, TH	110990037	SEEED
J101	1		Header, 100mil, 7x2, Tin, TH	Header, 7x2, 100mil, Tin	PEC07DAAN	Sullins Connector Solutions
J102	1		Receptacle, USB 2.0, Micro B, 5 Position, R/A, SMT	Receptacle, USB 2.0, Micro B, 5 Pos, 0.65mm Pitch, R/A, SMT	1051640001	Molex
L101	1	2.2uH	Inductor, Wirewound, Ceramic, 2.2 µH, 0.89 A, 0.13 ohm, SMD	2.5x1.8x1.8mm	CBC2518T2R2M	Taiyo Yuden
L102, L103	2	1000 ohm	Ferrite Bead, 1000 ohm @ 100 MHz, 0.6 A, 0603	0603	BLM18HE102SN1D	MuRata
LED1, LED101	2	Red	LED, Red, SMD	Red LED, 1.6x0.8x0.8mm	LTST-C190CKT	Lite-On
LED2, LED102	2	Green	LED, Green, SMD	1.6x0.8x0.8mm	LTST-C190GKT	Lite-On
MSP1	1		Mixed-Signal Microcontroller, PT0048A (LQFP-48)	PT0048A	MSP430FR2355TPT	Texas Instruments	XMS430FR2355TPT	Texas Instruments
MSP101	1		25 MHz Mixed Signal Microcontroller with 128 KB Flash, 8192 B SRAM and 47 GPIOs, -40 to 85 degC, 64-pin QFN (RGC), Green (RoHS & no Sb/Br)	RGC0064B	MSP430F5528IRGCT	Texas Instruments	Equivalent	Texas Instruments
MSP102	1		16 MHz Mixed Signal Microcontroller with 8 KB Flash, 256 B SRAM and 16 GPIOs, 16-pin QFN (RSA), Green (RoHS & no Sb/Br)	RSA0016B	MSP430G2452IRSA16R	Texas Instruments	Equivalent	Texas Instruments
Q1	1		Crystal, 32.768 KHz, 12.5 pF, SMD	SMD, 2-Leads, Body 3.2x1.5mm	ECS-.327-12.5-34B-TR	ECS Inc.
Q101	1		Resonator, 4MHz, 39pF SMD	4.5x1.2x2 mm	CSTCR4M00G15L99-R0	MuRata
R1	1	47.0k	RES, 47.0 k, 1%, 0.0625 W, 0402	0402	RC0402FR-0747KL	Yageo America
R2	1	470	RES, 470, 1%, 0.063 W, 0402	0402	RC0402FR-07470RL	Yageo America
R3	1	2.37Meg	RES, 2.37 M, 1%, 0.1 W, 0603	0603	CRCW06032M37FKEA	Vishay-Dale
R6	1	392	RES, 392, 1%, 0.063 W, 0402	0402	CRCW0402392RFKED	Vishay-Dale
R101, R120	2	470	RES, 470, 5%, 0.063 W, 0402	0402	CRCW0402470RJNED	Vishay-Dale
R102	1	390	RES, 390, 5%, 0.063 W, 0402	0402	CRCW0402390RJNED	Vishay-Dale
R103, R104	2	27	RES, 27, 5%, 0.063 W, 0402	0402	CRCW040227R0JNED	Vishay-Dale
R105	1	1.40k	RES, 1.40 k, 1%, 0.063 W, 0402	0402	CRCW04021K40FKED	Vishay-Dale
R106	1	1.0Meg	RES, 1.0 M, 5%, 0.063 W, 0402	0402	CRCW04021M00JNED	Vishay-Dale
R107, R108	2	4.70k	RES, 4.70 k, 1%, 0.063 W, 0402	0402	CRG0402F4K7	TE Connectivity
R109	1	47k	RES, 47 k, 5%, 0.063 W, 0402	0402	CRCW040247K0JNED	Vishay-Dale
R112, R113, R114, R115, R121, R122	6	221k	RES, 221 k, 1%, 0.063 W, 0402	0402	CRCW0402221KFKED	Vishay-Dale
R116, R117	2	4.7k	RES, 4.7 k, 5%, 0.063 W, 0402	0402	CRCW04024K70JNED	Vishay-Dale
R118	1	820	RES, 820, 1%, 0.063 W, 0402	0402	RC0402FR-07820RL	Yageo America
R119	1	0	RES, 0, 5%, 0.063 W, 0402	0402	CRCW04020000Z0ED	Vishay-Dale
R123	1	33k	RES, 33 k, 5%, 0.063 W, 0402	0402	CRCW040233K0JNED	Vishay-Dale
R124	1	240k	RES, 240 k, 1%, 0.063 W, 0402	0402	CRCW0402240KFKED	Vishay-Dale
R125	1	150k	RES, 150 k, 1%, 0.063 W, 0402	0402	CRCW0402150KFKED	Vishay-Dale
R126	1	2.20k	RES, 2.20 k, 1%, 0.063 W, 0402	0402	CRCW04022K20FKED	Vishay-Dale
R127	1	3.30k	RES, 3.30 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0402	0402	ERJ-2RKF3301X	Panasonic
R128	1	6.81k	RES, 6.81 k, 1%, 0.063 W, 0402	0402	CRCW04026K81FKED	Vishay-Dale
R129, R130	2	10.0	RES, 10.0, 1%, 0.063 W, 0402	0402	CRCW040210R0FKED	Vishay-Dale
S1, S2, S3	3		Switch, SPST, 0.05 A, 12 VDC, SMD	7.8x3.5mm	1188E-1K2-V-TR	Diptronics
SH-J7, SH-J8, SH-J9, SH-J10, SH-J11, SH-J101-1, SH-J101-2, SH-J101-3, SH-J101-4, SH-J101-5, SH-J101-6, SH-J101-7	12	1x2	Shunt, 100mil, Gold plated, Black	Shunt	969102-0000-DA	3M	SNT-100-BK-G	Samtec
T101	1	-20V	MOSFET, P-CH, -20 V, -0.82 A, SOT-323	SOT-323	DMG1013UW-7	Diodes Inc.		None
T102	1	45 V	Transistor, NPN, 45 V, 0.1 A, SOT-323	SOT-323	BC850CW,115	NXP Semiconductor
USB1	1		Cable, USB-A to micro USB-B, 0.3 m		AK67421-0.3	Assman WSW
C127	0	100pF	CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0402	0402	GRM1555C1H101JA01D	MuRata
FID1, FID2, FID3	0		Fiducial mark.  There is nothing to buy or mount.	N/A	N/A	N/A
TP101, TP102, TP103, TP104, TP105, TP106, TP107, TP108, TP109	0		Test Point, Miniature, Black, TH	Black Miniature Testpoint	5001	Keystone

详情请见:
https://www.ti.com/lit/ds/slasec4c/slasec4c.pdf
和https://www.ti.com/lit/ug/slau680/slau680.pdf